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Ceramic transient voltage suppressors
SMD multilayer transient voltage suppressors, radio frequency series
Series/Type: Date: August 2008
(c) EPCOS AG 2008. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Multilayer varistors (MLVs) Radio frequency series
EPCOS type designation system for radio frequency series CT
Construction: CT Single chip with nickel barrier termination (AgNiSn) Case sizes: 0402 0603 Tolerance for the varistor voltage: V Typical varistor voltage Typical varistor voltage (VV): 90 90 V 150 150 V 275 275 V Radio frequency series Taping mode: G 180-mm reel G2 330-mm reel
0402
V
150
RF
G
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Multilayer varistors (MLVs) Radio frequency series
Features Ultra-low capacitance ratings down to 0.6 pF Ultra-low DC leakage current Low insertion loss No signal attenuation ESD protection acc. to IEC-61000-4-2 level 4 Extremely fast response RoHS-compatible Suitable for lead-free soldering Applications ESD protection in mobile phones, handheld devices and wireless LAN/notebook and peripherals: RF antennas RF modules High-speed data lines USB 2.0 and IEEE 1394 interfaces Design Multilayer technology Lack of plastic or epoxy encapsulation for flammability rating better than UL 94 V-0 Termination (see "Soldering directions"): CT types with nickel barrier terminations (AgNiSn), recommended for lead-free soldering, and compatible with tin/lead solder. General technical data Maximum RMS operating voltage Maximum DC operating voltage Contact discharge ESD capability Air discharge ESD capability Maximum capacitance Operating temperature Operating temperature Storage temperature Storage temperature
Single chip Internal circuit
Available case sizes: EIA 0402 0603 Metric 1005 1608
to IEC 61000-4-2 to IEC 61000-4-2 (1 MHz, 1 V) for case size 0402 for case size 0603 for case size 0402 for case size 0603
VRMS,max VDC,max VESD,contact VESD,air Cmax Top Top Tstg Tstg
4 ... 14 5.5 ... 16 8 15 1 ... 5 40/+85 40/+125 40/+125 40/+150
V V kV kV pF C C C C
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Multilayer varistors (MLVs) Radio frequency series
Temperature derating Climatic category: 40/+85 C for 0402 Climatic category: 40/+125 C for 0603
Electrical specifications and ordering codes Maximum ratings (Top,max) Type Ordering code VRMS,max V 4 4 14 14 14 14 VDC,max V 5.5 5.5 16 16 16 16 Top,max C +85 +125 +85 +85 +85 +125
CT0402S5ARFG CT0603S5ARFG CT0402V150RFG CT0402V275RFG CT0402V90RFG CT0603V150RFG Characteristics (TA = 25 C) Type
B72590T7050S160 B72500T7050S160 B72590T7151V060 B72590T7271V060 B72590T7900V060 B72500T7151V060
CT0402S5ARFG CT0603S5ARFG CT0402V150RFG CT0402V275RFG CT0402V90RFG CT0603V150RFG
VV,min (1 mA) V 220 220 150 275 90 150
VV,max (1 mA) V 290 290 200 350 120 200
Ileak,typ (Vop = 3.5 V) A 0.0011) 0.0011) 0.001 0.001 0.001 0.001
Ctyp (1 MHz, 1 V) pF 0.6 0.6 2 1.5 2.2 3
Cmax (1 MHz, 1 V) pF 1 1 3 2 3 5
1) Mearsured @ VDC,max
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Multilayer varistors (MLVs) Radio frequency series
Dimensional drawing Dimensions in mm Case size EIA / mm 0402 / 1005 0603 / 1608 l w h 0.6 max. 0.9 max. k 0.10 ... 0.30 0.10 ... 0.40
1.0 0.15 0.50 0.10 1.6 0.15 0.80 0.10
Recommended solder pad layout Dimensions in mm Case size EIA / mm 0402 / 1005 0603 / 1608 A 0.60 1.00 B 0.60 1.00 C 0.50 1.00
Delivery mode EIA case size Taping 0402 0402 0402 0402 0603 0603 Cardboard Cardboard Cardboard Cardboard Cardboard Cardboard Reel size mm 180 180 180 180 180 180 Packing unit pcs. 10000 10000 10000 10000 4000 4000 Type CT0402S5ARFG CT0402V150RFG CT0402V275RFG CT0402V90RFG CT0603S5ARFG CT0603V150RFG Ordering code B72590T7050S160 B72590T7151V060 B72590T7271V060 B72590T7900V060 B72500T7050S160 B72500T7151V060
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Multilayer varistors (MLVs) Radio frequency series
Taping and packing 1 1.1 Taping and packing for SMD components Blister tape (the taping to IEC 60286-3)
Dimensions in mm 8-mm tape Case size (inch/mm) 0508/ 1220 0603/ 1608 A0 B0 K0 T T2 D0 D1 P0 P2 P1 W E F G
1) 0.2 mm over 10 sprocket holes.
12-mm tape Case size (inch/mm) 1012/ 2532 1210/ 3225 2.80 3.50 1812/ 4532 3.50 4.80 2.60 0.30 3.50 1.50 1.50 4.00 2.00 8.00 12.00 1.75 5.50 0.75 2220/ 5750 5.10 6.00
16-mm tape Case size (inch/mm) Tolerance
0612/ 1632 1206/ 3216 1.90 3.50 1.80
0506/ 1216 1.50 1.80 0.80
0805/ 2012 1.60 2.40 0.30
3225 4032 7.00 8.60 0.20 max. max. max. +0.10/ 0 min. 0.101) 0.05 0.10 0.30 0.10 0.05 min.
0.9 0.10 1.75 0.10 1.0 1.3
8.70 10.60 0.20 5.00 0.30 5.50 1.50 1.50 4.00 2.00 12.00 16.00 1.75 7.50 0.75
1.20 1.50 1.00 4.00 2.00 4.00 8.00 1.75 3.50 0.75
2.50
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Multilayer varistors (MLVs) Radio frequency series
Part orientation in tape pocket for blister tape For discrete chip, case sizes 0603, 0805, 1206, 1210, 1812 and 2220 For array, case sizes 0612
For arrays 0506 and 1012
For filter array, case size 0508
Additional taping information Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Polystyrol (PS) Polystyrol (PS) or Polycarbonat (PC) or PVC min. 10 N min. 10 N 0.2 to 0.6 N for 8-mm tape and 0.2 to 0.8 N for 12-mm tape at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165 to 180 Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20
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Multilayer varistors (MLVs) Radio frequency series
1.2
Cardboard tape (taping to IEC 60286-3)
Dimensions in mm 8-mm tape Case size (inch/mm) Case size Tolerance (inch/mm) 0.95 1.80 0.95 1.10 1.50 4.00 2.00 2.00 0.05 2.00 4.00 8.00 1.75 3.50 1.35 0.75 4.00 4.00 4.00 1.00 2.85 1.00 1.10 1.60 2.40 0.95 1.12 1.50 0.20 0.20 max. max. +0.10/ 0 0.102) 0.05 0.10 0.30 0.10 0.05 min.
0201/0603 0402/1005 0405/1012 0603/1608 1003/2508 0508/1220 A0 B0 T T2 D0 P0 P2 P1 W E F G
2) 0.2 mm over 10 sprocket holes.
0.38 0.05 0.68 0.05 0.35 0.02 0.4 min. 1.50 0.1
0.60 1.15 0.60 0.70
1.05 1.60 0.75 0.90
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Multilayer varistors (MLVs) Radio frequency series
Part orientation in tape pocket for cardboard tape For discrete chip case sizes 0201, 0402, 0603 and 1003 For array case size 0405
For array case size 0508
For filter array, case size 0405
Additional taping information Reel material Tape material Tape break force Top cover tape strength Top cover tape peel force Tape peel angle Cavity play Polystyrol (PS) Cardboard min. 10 N min. 10 N 0.1 to 0.65 N at a peel speed of 300 mm/min Angle between top cover tape and the direction of feed during peel off: 165 to 180 Each part rests in the cavity so that the angle between the part and cavity center line is no more than 20
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Multilayer varistors (MLVs) Radio frequency series
1.3
Reel packing
Dimensions in mm 8-mm tape 180-mm reel A W1 W2 180 3/+0 330-mm reel 330 2.0 12-mm tape 180-mm reel 180 3/+0 330-mm reel 330 2.0 16-mm tape 330-mm reel 330 2.0
8.4 +1.5/ 0 14.4 max.
8.4 +1.5/ 0 14.4 max.
12.4 +1.5/ 0 18.4 max.
12.4 +1.5/ 0 18.4 max.
16.4 +1.5/ 0 22.4 max.
Leader, trailer
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Multilayer varistors (MLVs) Radio frequency series
Soldering directions 1 1.1 Terminations Nickel barrier termination
The nickel barrier layer of the silver/nickel/tin termination prevents leaching of the silver base metallization layer. This allows great flexibility in the selection of soldering parameters. The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The nickel barrier termination is suitable for all commonly-used soldering methods.
Multilayer CTVS: Structure of nickel barrier termination 1.2 Silver-palladium termination
Silver-palladium terminations are used for the large case sizes 1812 and 2220 and for chips intended for conductive adhesion. This metallization improves the resistance of large chips to thermal shock. In case of conductive adhesion, the silver-palladium metallization reduces susceptibility to corrosion. Silver-palladium termination can be used for smaller case sizes (only chip) for hybrid applications as well. The silver-palladium termination is not approved for lead-free soldering.
Multilayer varistor: Structure of silver-palladium termination
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Multilayer varistors (MLVs) Radio frequency series
2 2.1
Recommended soldering temperature profiles Reflow soldering temperature profile
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature Preheat and soak - Temperature min - Temperature max - Time Average ramp-up rate Liquidous temperature Time at liquidous Peak package body temperature Time (tP)3) within 5 C of specified classification temperature (Tc) Average ramp-down rate Time 25 C to peak temperature
Sn-Pb eutectic assembly Tsmin Tsmax tsmin to tsmax Tsmax to Tp TL tL Tp1) 100 C 150 C 60 ... 120 s 3 C/ s max. 183 C 60 ... 150 s 220 C ... 235 C2) 20 s3) Tp to Tsmax 6 C/ s max. maximum 6 min
Pb-free assembly 150 C 200 C 60 ... 180 s 3 C/ s max. 217 C 60 ... 150 s 245 C ... 260 C2) 30 s3) 6 C/ s max. maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. 2) Depending on package thickness. For details please refer to JEDEC J-STD-020D. 3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface. Number of reflow cycles: 3
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Multilayer varistors (MLVs) Radio frequency series
2.2
Wave soldering temperature profile
Temperature characteristics at component terminal with dual-wave soldering
2.3
Lead-free soldering processes
EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free soldering processes only. Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommendations.
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Multilayer varistors (MLVs) Radio frequency series
3 3.1 Type
Recommended soldering methods - type-specific releases by EPCOS Overview Reflow soldering Case size 0201/ 0402 0603 ... 2220 0603 ... 2220 0405 ... 1012 3225, 4032 SnPb Approved Approved Approved Approved Approved Approved No Lead-free Approved Approved No Approved Approved Approved No Wave soldering SnPb No Approved Approved No No Approved Approved Lead-free No Approved No No No Approved Approved
CT... / CD... CT... / CD... CN... Arrays CU SHCV 3.2
ESD/EMI filters 0405, 0508
Nickel barrier terminated multilayer CTVS
All EPCOS MLVs with nickel barrier termination are suitable and fully qualiyfied for lead-free soldering. The nickel barrier layer is 100% matte tin-plated. 3.3 Silver-palladium terminated MLVs
AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid material. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb solder. Note: Lead-free soldering is not approved for MLVs with AgPd termination. 3.4 Tinned copper alloy
All EPCOS CU types with tinned termination are approved for lead-free and SnPb soldering. 3.5 Tinned iron wire
All EPCOS SHCV types with tinned termination are approved for lead-free and SnPb soldering.
4 4.1
Solder joint profiles / solder quantity Nickel barrier termination
If the meniscus height is too low, that means the solder quantity is too low, the solder joint may break, i.e. the component becomes detached from the joint. This problem is sometimes interpreted as leaching of the external terminations.
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Multilayer varistors (MLVs) Radio frequency series
If the solder meniscus is too high, i.e. the solder quantity is too large, the vise effect may occur. As the solder cools down, the solder contracts in the direction of the component. If there is too much solder on the component, it has no leeway to evade the stress and may break, as in a vise. The figures below show good and poor solder joints for dual-wave and infrared soldering. 4.1.1 Solder joint profiles for nickel barrier termination - dual-wave soldering
Good and poor solder joints caused by amount of solder in dual-wave soldering. 4.1.2 Solder joint profiles for nickel barrier termination / silver-palladium termination - reflow soldering
Good and poor solder joints caused by amount of solder in reflow soldering.
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Multilayer varistors (MLVs) Radio frequency series
5
Conductive adhesion
Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commercially attractive method of component connection to supplement or even replace conventional soldering methods. Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are embedded. Electrical conduction is effected by contact between the metal particles. Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives can be deposited ready for production requirements by screen printing, stamping or by dispensers. As shown in the following table, conductive adhesion involves two work operations fewer than soldering. Reflow soldering Screen-print solder paste Mount SMD Predry solder paste Reflow soldering Wash Inspect Wave soldering Apply glue dot Mount SMD Cure glue Wave soldering Wash Inspect Conductive adhesion Screen-print conductive adhesive Mount SMD Cure adhesive Inspect
A further advantage of adhesion is that the components are subjected to virtually no temperature shock at all. The curing temperatures of the adhesives are between 120 C and 180 C, typical curing times are between 30 minutes and one hour. The bending strength of glued chips is, in comparison with that of soldered chips, higher by a factor of at least 2, as is to be expected due to the elasticity of the glued joints. The lower conductivity of conductive adhesive may lead to higher contact resistance and thus result in electrical data different to those of soldered components. Users must pay special attention to this in RF applications.
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Multilayer varistors (MLVs) Radio frequency series
6 Test
Solderability tests Standard Test conditions Sn-Pb soldering Test conditions Pb-free soldering Immersion in Sn96.5Ag3.0Cu0.5 solder using non- or low activated flux at 245 5 C for 3 0.3 s Criteria/ test results Covering of 95% of end termination, checked by visual inspection
Wettability
IEC Immersion in 60068-2-58 60/40 SnPb solder using non-activated flux at 215 3 C for 3 0.3 s IEC Immersion in 60068-2-58 60/40 SnPb solder using mildly activated flux without preheating at 260 5 C for 10 1 s Dip soldering at 300 C/5 s
Leaching resistance
Immersion in No leaching of Sn96.5Ag3.0Cu0.5 contacts solder using non- or low activated flux without preheating at 255 5 C for 10 1 s Dip soldering at 300 C/5 s No deterioration of electrical parameters. Capacitance change: 15% Change of varistor voltage: 5% Change of varistor voltage: 5% Change of capacitance X7R: 5/+10%
Thermal shock (solder shock)
Tests of resistance IEC Immersion in Immersion in to soldering heat 60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5 for SMDs at 260 C for 10 s at 260 C Tests of resistance IEC to soldering heat 60068-2-20 for radial leaded components (SHCV) Immersion of leads in 60/40 SnPb for 10 s at 260 C Immersion of leads in Sn96.5Ag3.0Cu0.5 for 10 s at 260 C
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Multilayer varistors (MLVs) Radio frequency series
Note: Leaching of the termination Effective area at the termination might be lost if the soldering temperature and/or immersion time are not kept within the recommended conditions. Leaching of the outer electrode should not exceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B, shown below as mounted on substrate.
As a single chip
As mounted on substrate
7 7.1
Notes for proper soldering Preheating and cooling
According to JEDEC J-STD-020D. Please refer to chapter 2. 7.2 Repair / rework
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for rework purposes. 7.3 Cleaning
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning solution according to the type of flux used. The temperature difference between the components and cleaning liquid must not be greater than 100 C. Ultrasonic cleaning should be carried out with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metallized surfaces. 7.4 Solder paste printing (reflow soldering)
An excessive application of solder paste results in too high a solder fillet, thus making the chip more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be applied smoothly to the end surface.
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Multilayer varistors (MLVs) Radio frequency series
7.5
Adhesive application
Thin or insufficient adhesive causes chips to loosen or become disconnected during curing. Low viscosity of the adhesive causes chips to slip after mounting. It is advised to consult the manufacturer of the adhesive on proper usage and amounts of adhesive to use. 7.6 Selection of flux
Used flux should have less than or equal to 0.1 wt % of halogenated content, since flux residue after soldering could lead to corrosion of the termination and/or increased leakage current on the surface of the component. Strong acidic flux must not be used. The amount of flux applied should be carefully controlled, since an excess may generate flux gas, which in turn is detrimental to solderability. 7.7 Storage of CTVSs
Solderability is guaranteed for one year from date of delivery for multilayer varistors, CeraDiodes and ESD/EMI filters (half a year for chips with AgPd terminations) and two years for SHCV and CU components, provided that components are stored in their original packages. Storage temperature: 25 C to +45 C Relative humidity: 75% annual average, 95% on 30 days a year The solderability of the external electrodes may deteriorate if SMDs and leaded components are stored where they are exposed to high humidity, dust or harmful gas (hydrogen chloride, sulfurous acid gas or hydrogen sulfide). Do not store SMDs and leaded components where they are exposed to heat or direct sunlight. Otherwise the packing material may be deformed or SMDs/ leaded components may stick together, causing problems during mounting. After opening the factory seals, such as polyvinyl-sealed packages, it is recommended to use the SMDs or leaded components as soon as possible. 7.8 Placement of components on circuit board
Especially in the case of dual-wave soldering, it is of advantage to place the components on the board before soldering in that way that their two terminals do not enter the solder bath at different times. Ideally, both terminals should be wetted simultaneously. 7.9 Soldering cautions
An excessively long soldering time or high soldering temperature results in leaching of the outer electrodes, causing poor adhesion and a change of electrical properties of the varistor due to the loss of contact between electrodes and termination. Wave soldering must not be applied for MLVs designated for reflow soldering only. Keep the recommended down-cooling rate.
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Multilayer varistors (MLVs) Radio frequency series
7.10
Standards
CECC 00802 IEC 60068-2-58 IEC 60068-2-20 JEDEC J-STD-020D
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Symbols and terms Symbol Cline,typ Cmax Cmin Cnom Cnom Ctyp fcut-off,min I Iclamp Ileak Ileak,typ IPP Isurge,max LCT Ltyp Pdiss,max PPP Rins Rmin RS TA Top Tstg tr tresp UCT V VBR,min Vclamp,max VDC,max VESD,air VESD,contact Vjump Term Typical capacitance per line Maximum capacitance Minimum capacitance Nominal capacitance Tolerance of nominal capacitance Typical capacitance Minimum cut-off frequency Current Clamping current Leakage current Typical leakage current Peak pulse current Maximum surge current (also termed peak current) Lower category temperature Typical inductance Maximum power dissipation Peak pulse power Insulation resistance Minimum resistance Resistance per line Ambient temperature Operating temperature Storage temperature Duration of equivalent rectangular wave Response time Upper category temperature Voltage Minimum breakdown voltage Maximum clamping voltage Maximum DC operating voltage (also termed working voltage) Air discharge ESD capability Contact discharge ESD capability Maximum jump start voltage
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Multilayer varistors (MLVs) Radio frequency series
VRMS,max VV VV,min VV,max VV WLD Wmax typ *
Maximum AC operating voltage, root-mean-square value Varistor voltage (also termed breakdown voltage) Minimum varistor voltage Maximum varistor voltage Tolerance of varistor voltage Maximum load dump Maximum energy absorption (also termed transient energy) Typical insertion loss Lead spacing Maximum possible application conditions
All dimensions are given in mm. The commas used in numerical values denote decimal points.
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Multilayer varistors (MLVs) Radio frequency series
Cautions and warnings General Some parts of this publication contain statements about the suitability of our ceramic transient voltage suppressor (CTVS) components (multilayer varistors (MLVs), CeraDiodes, ESD/EMI filters, SMD disk varistors (CU types), leaded transient voltage/ RFI suppressors (SHCV types)) for certain areas of application, including recommendations about incorporation/design-in of these products into customer applications. The statements are based on our knowledge of typical requirements often made of our CTVS devices in the particular areas. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our CTVS components for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always incumbent on the customer to check and decide whether the CTVS devices with the properties described in the product specification are suitable for use in a particular customer application. Do not use EPCOS CTVS components for purposes not identified in our specifications, application notes and data books. Ensure the suitability of a CTVS in particular by testing it for reliability during design-in. Always evaluate a CTVS component under worst-case conditions. Pay special attention to the reliability of CTVS devices intended for use in safety-critical applications (e.g. medical equipment, automotive, spacecraft, nuclear power plant). Design notes Always connect a CTVS in parallel with the electronic circuit to be protected. Consider maximum rated power dissipation if a CTVS has insufficient time to cool down between a number of pulses occurring within a specified isolated time period. Ensure that electrical characteristics do not degrade. Consider derating at higher operating temperatures. Choose the highest voltage class compatible with derating at higher temperatures. Surge currents beyond specified values will puncture a CTVS. In extreme cases a CTVS will burst. If steep surge current edges are to be expected, make sure your design is as low-inductance as possible. In some cases the malfunctioning of passive electronic components or failure before the end of their service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In applications requiring a very high level of operational safety and especially when the malfunction or failure of a passive electronic component could endanger human life or health (e.g. in accident prevention, life-saving systems, or automotive battery line applications such as clamp 30), ensure by suitable design of the application or other measures (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of such a malfunction or failure. Only use CTVS components from the automotive series in safety-relevant applications. Specified values only apply to CTVS components that have not been subject to prior electrical, mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is
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Multilayer varistors (MLVs) Radio frequency series
therefore not advisable, and it is only allowed together with safety countermeasures like thermal fuses. Storage Only store CTVS in their original packaging. Do not open the package before storage. Storage conditions in original packaging: temperature 25 to +45C, relative humidity 75% annual average, maximum 95%, dew precipitation is inadmissible. Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the packaging material may be deformed or CTVS may stick together, causing problems during mounting. Avoid contamination of the CTVS surface during storage, handling and processing. Avoid storing CTVS devices in harmful environments where they are exposed to corrosive gases for example (SOx, Cl). Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages. Solder CTVS components after shipment from EPCOS within the time specified: CTVS with Ni barrier termination, 12 months CTVS with AgPd termination, 6 months SHCV and CU series, 24 months Handling Do not drop CTVS components and allow them to be chipped. Do not touch CTVS with your bare hands - gloves are recommended. Avoid contamination of the CTVS surface during handling. Mounting When CTVS devices are encapsulated with sealing material or overmolded with plastic material, electrical characteristics might be degraded and the life time reduced. Make sure an electrode is not scratched before, during or after the mounting process. Make sure contacts and housings used for assembly with CTVS components are clean before mounting. The surface temperature of an operating CTVS can be higher. Ensure that adjacent components are placed at a sufficient distance from a CTVS to allow proper cooling. Avoid contamination of the CTVS surface during processing. Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering. Soldering Complete removal of flux is recommended to avoid surface contamination that can result in an instable and/or high leakage current. Use resin-type or non-activated flux. Bear in mind that insufficient preheating may cause ceramic cracks. Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.
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Multilayer varistors (MLVs) Radio frequency series
Conductive adhesive gluing Only multilayer varistors (MLVs) with an AgPd termination are approved for conductive adhesive gluing. Operation Use CTVS only within the specified operating temperature range. Use CTVS only within specified voltage and current ranges. Environmental conditions must not harm a CTVS. Only use them in normal atmospheric conditions. Reducing the atmosphere (e.g. hydrogen or nitrogen atmosphere) is prohibited. Prevent a CTVS from contacting liquids and solvents. Make sure that no water enters a CTVS (e.g. through plug terminals). Avoid dewing and condensation. EPCOS CTVS components are mainly designed for encased applications. Under all circumstances avoid exposure to: direct sunlight rain or condensation steam, saline spray corrosive gases atmosphere with reduced oxygen content EPCOS CTVS devices are not suitable for switching applications or voltage stabilization where static power dissipation is required. Multilayer varistors (MLVs) are designed for ESD protection and transient suppression. CeraDiodes are designed for ESD protection only, ESD/EMI filters are designed for ESD and EMI protection only. This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
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Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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